Decentralized applications (dApps) in Decentralized Finance (DeFi) face a fundamental tension between regulatory compliance requirements like Know Your Customer (KYC) and maintaining decentralization and privacy. Existing permissioned DeFi solutions often fail to adequately protect private attributes of dApp users and introduce implicit trust assumptions, undermining the blockchain's decentralization. Addressing these limitations, this paper presents a novel synthesis of Self-Sovereign Identity (SSI), Zero-Knowledge Proofs (ZKPs), and Attribute-Based Access Control to enable privacy-preserving on-chain permissioning based on decentralized policy decisions. We provide a comprehensive framework for permissioned dApps that aligns decentralized trust, privacy, and transparency, harmonizing blockchain principles with regulatory compliance. Our framework supports multiple proof types (equality, range, membership, and time-dependent) with efficient proof generation through a commit-and-prove scheme that moves credential authenticity verification outside the ZKP circuit. Experimental evaluation of our KYC-compliant DeFi implementation shows considerable performance improvement for different proof types compared to baseline approaches. We advance the state-of-the-art through a holistic approach, flexible proof mechanisms addressing diverse real-world requirements, and optimized proof generation enabling practical deployment.
Cross-chain decentralized finance ( DeFi) applications enable the seamless transfer of assets and data across diverse blockchain networks, thereby enhancing liquidity and user flexibility. However, the distributed nature and inter-operability of these networks introduce significant security challenges, ranging from double-spending and smart contract vulnerabilities to mismatches in consensus mechanisms and privacy risks. In this survey, we introduce a novel review about the recent literature that explores these multifaceted challenges. We categorize the research based on attack vectors and the security requirements of cross-chain systems, discuss state-of-the-art solutions including advanced cryptographic techniques and rigorous auditing practices, and outline open problems that warrant further explorations. Our work provides a comprehensive analysis of the current security landscape in cross-chain DeFi and emphasizes future research directions.
Physical Unclonable Functions (PUFs) and Hardware Security
Scalability remains a major challenge in blockchain technology, particularly for Layer-1 networks like Ethereum, where high transaction volumes cause congestion and high gas fees. Zero-Knowledge (ZK) Rollups have emerged as scalable Layer-2 solutions, offering enhanced security and lower transaction costs. However, existing zk-Rollups such as zkSync Era, dYdX, and StarkNet each have their advantages and limitations in terms of efficiency, cost, and decentralization. This paper proposes zkFusion, a hybrid zk-Rollup protocol that combines the most effective features of these rollups to achieve faster transaction rates, improved cost-effectiveness, and enhanced security. zkFusion employs a flexible proof mechanism, optimized transaction batching, and a modular data throughput method, allowing users to balance between cost and security. Additionally, it integrates a decentralized sequencer to enhance network reliability and mitigate centralization risks. Comparative evaluation with existing zk-Rollups demonstrates that zkFusion significantly reduces transaction fees, improves throughput, and maintains high security assurances. By blending the innovations of zkSync Era, dYdX, and StarkNet, zkFusion aims to set a new benchmark for scalability, efficiency, and cost reduction in Layer-2 blockchain solutions.
Federated Learning (FL) is a widespread approach that allows training machine learning (ML) models with data distributed across multiple devices. In cross-silo FL, which often appears in domains like healthcare or finance, the number of participants is moderate, and each party typically represents a well-known organization. For instance, in medicine data owners are often hospitals or data hubs which are well-established entities. However, malicious parties may still attempt to disturb the training procedure in order to obtain certain benefits, for example, a biased result or a reduction in computational load. While one can easily detect a malicious agent when data used for training is public, the problem becomes much more acute when it is necessary to maintain the privacy of the training dataset. To address this issue, there is recently growing interest in developing verifiable protocols, where one can check that parties do not deviate from the training procedure and perform computations correctly. In this paper, we present a systematization of knowledge on verifiable cross-silo FL. We analyze various protocols, fit them in a taxonomy, and compare their efficiency and threat models. We also analyze Zero-Knowledge Proof (ZKP) schemes and discuss how their overall cost in a FL context can be minimized. Lastly, we identify research gaps and discuss potential directions for future scientific work.
Abstract The implementation of microelectronics, also known as multi-chip modules (MCM), is extensive in automotive, downhole and aerospace applications. MCMs have already demonstrated high-temperature performance, step improvement in reliability, and the potential to reduce product cost through miniaturization and integration of more functions. However, there are barriers preventing wider adoption of MCM technology in downhole applications. High non-recurring expenditures (NRE) charges increase development costs. Long substrate lead times prolong the time to market. Lengthy design iterations make it difficult to apply lean startup methodology to accelerate innovation. The main factor that leads to high NRE and long lead times is the complexity of substrate manufacturing processes. Together with assembly, MCM manufacturing comprises at least 11 steps, 6 different materials, 10 or more different machines, and requires a minimum of 6 supporting employees. A new concept proposes a simplified process to reduce labor and expenses. With best implementation, this process would require only a single machine capable of cycling through 3-step process of dispensing, placement and cure. Despite the dramatically simplified process, the constructional complexity of circuits can still be very high, such as a 3D multilayer MCM. In this paper, this concept was evaluated, micro-dispensing equipment was used to create basic circuitry blocks. Different materials to create conductive traces, isolation layers and wire bond replacement were evaluated. High-temperature aging tests were conducted to monitor the electrical and mechanical performance under thermal stress. The feasibility of dispensing fine features using dispensing and jetting methods are presented in the study. Conductors are a critical part in microelectronic assemblies because they create interconnects and thermal dissipation paths for microelectronics. Three different conductor materials were tested for their dispensability, resistance, continuity at temperature, and coefficients of thermal expansion (CTE) compatibility with different materials under thermal cycling. For dielectric materials, the requirements were to create various assembly constructs. The characterization included dispensability, electrical insulation, breakdown voltage, high-temperature performance, and the effects of CTE. Different approaches with different materials were tested for feasibility for wire bonding replacement. The application needs fine feature size with medium resistance lines. Consequently, the criteria for the material selection are fine particle size and medium sheet resistance. For high-power devices where heavy-gauge wires were used, jet dispensing is applicable. For other application with regular wire diameters, direct write is used. The over-all tests demonstrated the feasibility of using dispensed materials to replace wire bonds, which brings better reliability for shock and vibration, as compared to traditional wire bonds. The reliability of this approach requires a set of optimally matched conductive and dielectric materials. Three conductive materials (A, B and C) and three dielectric materials (D, E and F) were evaluated in this study. Tested conductive epoxy A can be used for attachment of SMT components with non-tin terminals, short traces, and wire bonding replacement for 25-μm wires, but it is not ideal for fine lines(<65um). Tested conductive epoxy B can be used for fine traces (58μm), and wire bonding replacement for 25-μm wires. The resistance of that material is not ideal. Nano-silver paste can be used for long traces, heavy-gauge wire bonding replacement, pads/polygons, the sheet resistance is equivalent to 0.5Oz Cu. For dielectrics, epoxy C can be used for crossovers, dielectric layers, and components staking. Epoxy D can be used for die edge insulation, but it is not ideal. Epoxy E can be used for crossovers and components staking. Epoxy F can be used for encapsulation and components staking. The wire bonding replacement concept structure is established with the dielectric forming the insulation around die edge, then the conductive wires dispensed on top of it. Feasibility was confirmed, a proof-of-concept was built, and some level of thermal stress was tested on the samples. Particle size and viscosity are critical to achieve fine features for micro-dispensing conductors and dielectrics. Periodic evaluations must be conducted to follow up on industry's progress with materials.
Additive Manufacturing and 3D Printing Technologies